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  caution although this device is designed to be as robust as possible, esd (electrostatic discharge) can damage this device. this device must be protected at all times from esd. static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. industry - standard esd precautions must be employed at all times. 0.0 5 to 3.0 ghz spdt switch gaas integrated circuit ? pg2 40 8 t k document no. pg10 7 7 1 ej0 1 v0ds ( 1st edition) date published j uly 200 9 ns description the ? pg 2408tk is a gaas mmic for l , s - band spdt ( s ingle p ole d ouble t hrow) switch for 2.4 ghz wireless lan, mobile phone and other l , s - band application s . this device operate s with dual control switching voltage s of 2.5 to 5.3 v. this device can operate at frequenc ies from 0. 0 5 to 3.0 ghz, with low insertion loss and high isolation. this device is housed in a 6 - pin lead - less minimold package ( 1511 pkg ) a nd is suit able for high - density surface mounting. features ? switch control voltage : v con t (h) = 3.0 v typ. : v cont (l) = 0 v typ. ? low insertion loss : l ins = 0. 40 db typ. @ f = 1 . 0 ghz : l ins = 0. 50 db typ. @ f = 2.5 ghz ? high isolation : isl = 27 db typ. @ f = 1.0 ghz : isl = 1 8 db typ. @ f = 2.5 ghz ? h andling power : p in ( 0. 1 db) = + 29.0 dbm typ. @ f = 0.5 to 3.0 ghz ? high - density surface mounting : 6 - pin lead - less minimold package ( 1.5 ? 1.1 ? 0.55 mm ) applications ? l , s - band digital cellular or cordless telephone ? w - lan, wll and bluetooth tm etc. ordering information part n umber order number package marking supplying form ? pg 2408tk - e 2 ? pg 2408tk - e 2 - a 6 - pin lead - less minimold (1511 pkg) (pb - free) g5 x ? embossed tape 8 mm wide ? pin 1, 6 face the perforation side of the tape ? qty 5 kpcs/reel remark to order evaluation samp les, please contact your nearby sales office. part number for sample order: ? pg 2408tk - a
data sheet pg10 7 7 1 ej0 1 v0ds 2 ? pg2 40 8 t k pin connections and internal block diagram pin no. pin name 1 rf1 2 gnd 3 rf 2 4 v cont 2 5 rfc 6 v cont 1 sw truth table on path v cont1 v cont 2 rfc - rf1 low high rfc - rf2 high low absolute maximum ratings (t a = +25 ? parameter symbol ratings unit switch control voltage v cont + 6.0 note v input power p in +33.0 dbm operating ambient temperature t a ? 45 to +85 ? c stora ge temperature t stg ? 55 to +150 ? c note ? v cont 1 ? v cont 2 ? ? 6.0 v recommended operating range (t a = +25 ? parameter symbol min. typ. max. unit operating frequency f 0.05 ? 3.0 ghz switch control voltage (h) v cont (h) 2. 5 3.0 5.3 v switch control voltage (l) v cont (l) ? 0.2 0 0.2 v control voltage difference ? v cont (h) , ? v cont (l) note ? 0.1 0 0.1 v note ? v cont (h) = v cont 1 (h) ? v cont 2 (h) ? v cont (l) = v cont 1 (l) ? v cont 2 (l)
data sheet pg10 7 7 1 ej0 1 v0ds 3 ? pg2 40 8 t k electrical characteristics (t a = +25 ? cont (h) = 3.0 v, v cont (l) = 0 v, dc blocking capacitors = 56 pf, unless otherwise specified) parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins 1 f = 0.05 to 0.5 ghz note 1 ? 0.40 0. 5 5 db insertion loss 2 l ins 2 f = 0.5 to 1.0 ghz ? 0.40 0. 5 5 db insertion loss 3 l ins 3 f = 1.0 to 2.0 ghz ? 0.4 8 0. 63 db insertion loss 4 l ins 4 f = 2.0 to 2.5 ghz ? 0. 50 0. 6 5 db insertion loss 5 l ins 5 f = 2.5 to 3.0 ghz ? 0.5 6 0. 7 0 db isolation 1 isl 1 f = 0.05 to 0.5 ghz note 1 2 4 27 ? db isolat ion 2 isl 2 f = 0.5 to 1.0 ghz 2 4 27 ? db isolation 3 isl 3 f = 1.0 to 2.0 ghz 16 19 ? db isolation 4 isl 4 f = 2.0 to 2.5 ghz 1 5 1 8 ? db isolation 5 isl 5 f = 2.5 to 3.0 ghz 14 17 ? db input return loss 1 rl in 1 f = 0.05 to 0.5 ghz note 1 15 20 ? db input return loss 2 rl in 2 f = 0.5 to 3.0 ghz 15 20 ? db output return loss 1 rl out 1 f = 0.05 to 0.5 ghz note 1 15 20 ? db output return loss 2 rl out 2 f = 0.5 to 3.0 ghz 15 20 ? db 0.1 db loss compression p in (0.1 db) f = 2.0/2.5 ghz +2 7 .0 +2 9 .0 ? dbm input power note 2 f = 0.5 to 3.0 ghz ? +2 9 .0 ? dbm in put 3rd order intercept point iip 3 f = 0.5 to 3.0 ghz, 2 tone, 5 mhz spicing ? + 60 ? dbm switch control current i cont no rf input ? 0. 3 20 ? a switch control speed t sw 50% ctl to 90/10% rf ? 5 0 5 00 ns no te s 1. dc blocking capacitors = 1 000 pf at f = 0.0 5 to 0.5 ghz 2. p in (0.1 db) is the measured input power level when the insertion loss increases 0.1 db more than that of linear range. caution it is necessary to use dc blocking capacitors with this dev ice. the value of dc blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. the range of recommended dc blocking capacitor value is less than 100 pf f or frequencies above 0.5 ghz, and 1 000pf for frequencies above 0.5 ghz .
data sheet pg10 7 7 1 ej0 1 v0ds 4 ? pg2 40 8 t k evaluation circuit note c 1 : 0.05 to 0.5 ghz 1 0 00 pf : 0.5 to 3.0 ghz 56 pf c2 : 1 000 pf the application circuits and their parameters are for reference only and are not intended for use in actual design - ins. application information ? l esd provides a means to increase the esd protection on a specific rf port, typically the port attached to the antenna. ? the value may be tailored to provide specific electrical responses. ? the rf ground connections should be kept as short as possible and connected to directly to a good rf ground for best performance.
data sheet pg10 7 7 1 ej0 1 v0ds 5 ? pg2 40 8 t k illustration of the test circuit assembled on evaluation board using the evaluation board symbol test conditions values c1 f = 0.05 to 0.5 ghz 1 000 pf f = 0.5 to 3.0 ghz 56 pf c2 1 000 pf
data sheet pg10 7 7 1 ej0 1 v0ds 6 ? pg2 40 8 t k typ ical characteristics ( t a = +25 ? remark the graphs indicate nominal characteristics.
data sheet pg10 7 7 1 ej0 1 v0ds 7 ? pg2 40 8 t k remark the graphs indicate nominal characteristics.
data sheet pg10 7 7 1 ej0 1 v0ds 8 ? pg2 40 8 t k mounting pad layout dimensions 6 - pin lead - l ess minimold (1511 pkg) (unit: mm) remark the mounting pad layout in this document is for reference only. when designing pcb, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optim ize the design.
data sheet pg10 7 7 1 ej0 1 v0ds 9 ? pg2 40 8 t k package dimensions 6 - pin lead - less minimold (1511 pkg) (unit: mm)
data sheet pg10 7 7 1 ej0 1 v0ds 10 ? pg2 40 8 t k recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less tim e at temperature of 220 ? c or higher : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperatu re (molten solder temperature) : 260 ? c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 ? c or below maximum number of flow processes : 1 time maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature ( terminal temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use diffe rent soldering methods together (except for partial heating).
data sheet pg10 7 7 1 ej0 1 v0ds 11 ? pg2 40 8 t k caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health i f inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposing of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal comp any able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlle d (as industrial waste subject to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.


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